Teledyne Microwave Solutions has developed an innovative low cost custom packaging solution utilizing Teledyne Labtech's established microwave printed circuit board techniques and the use of low cost organic materials for single chip & MCM (Multichip Module) applications. Markets served include Defense, Aerospace, and Telecommunications.
TMS MMIC PACKAGING AT-A-GLANCE
Explore TMS MMIC PACKAGING
TMS has developed a cavity package that demonstrates excellent high frequency, thermal and electrical characteristics by raising the MMIC in a precisely machined, fully copper plated cavity. The resultant optimization of short bond wire lengths ensures minimal loss of chip performance. Applications and Markets include Defense, Aerospace, Telecommunications, LNAs, T/R modules, and PA modules. Our MMIC packaging is also suitable for high power GaN applications up to and including Ka-band.
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